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MediaTek Showcases Next-Gen Connectivity

Taiwanese chipmaker MediaTek will be demonstrating an ecosystem of production-ready devices at CES 2023 that will make use of the Wi-Fi 7 technology. The company was one of the first adopters of the next-gen wireless connectivity standard.Wi-Fi 7 is the “friendly name” for the 802.11be standard and brings a number of improvements over the preceding Wi-Fi 6 and Wi-Fi 6E standards speeds of up to 46 Gbps, increased throughput, and reduced latency.

 

MediaTek’s catalogue of Wi-Fi 7 products uses the company’s latest Filogic chips, which combine a Wi-Fi 7 access point technology to broadband operators, retail router channels and enterprise markets. They’ll also use the Filogic 380 chipset, which is designed to bring Wi-Fi 7 connectivity to all client devices.MediaTek assures that the Wi-Fi solution reduces main power consumption by 50%, reduces CPU utilization by 25 times, and has a 100x lower MLO switch latency.

 

“Last year, we gave the world’s first Wi-Fi 7 technology demonstration, and we are honoured to now show the significant progress we have made in building a more complete ecosystem of products. This lineup of devices, many of which are powered by the CES 2023 Innovation Award-winning Filogic 880 flagship chipset, illustrates our commitment to providing the best wireless connectivity,” elaborated Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity Business unit at MediaTek.

 

 

 

 

 

 

 

 

 

 

 

 

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